| 1. | Wafer fabrication module
圆片制造用组件 |
| 2. | Scheduling rule for batch processing machines of semiconductor wafer fabrication facilities
半导体生产线批加工设备调度规则 |
| 3. | Wafer fabrication line
薄片制造线 |
| 4. | Promote the manufacture of high value - added products , e . g . wafer fabrication , flip chip technology
-增加了高附加值产品的生产，如无线电晶片、芯片等 |
| 5. | September 8 , 2007 , intel broke ground on its first 300mm wafer fabrication facility in asia
2007年9月8日，英特尔在亚洲的第一座300毫米晶圆工厂大连芯片厂破土奠基。 |
| 6. | Smic is a pure - play ic foundry that provides wafer fabrication of 8 - inch and 12 - inch wafers at 0 . 35 - micron to 0 . 11 - micron technologies
中芯国际是一家纯商业性芯片代工企业,提供0 . 35微米至0 . 11微米技术工艺的8英寸和12英寸芯片代工服务。 |
| 7. | Esd is an issue not only for finished products but also during their manufacture , from wafer fabrication to packaging to the assembly of complete systems
Esd的问题不仅对于成品来说很重要，在制造过程中（从晶圆制程、封装到组装整个系统）也是很重要的课题。 |
| 8. | March 26th , 2007 intel announced plans to build a 300 - millimeter ( mm ) wafer fabrication facility ( fab ) in the coastal city of dalian , in northeast china ' s liaoning province
2007年3月26日，英特尔宣布在大连投资25亿美元，建立一座90纳米技术的300毫米晶圆厂。 |
| 9. | According to the characteristics of dynamic bottleneck in semiconductor wafer fabrication system ( swfs ) , a dynamic bottleneck real - time dispatching ( dbrd ) strategy was proposed
摘要针对半导体晶圆制造系统中瓶颈设备动态漂移的特性，提出一种动态瓶颈实时派工策略。 |
| 10. | A new agent - based dynamic scheduling approach for semiconductor wafer fabrication was proposed , which integrated release control , dispatching and machine preventive maintenance scheduling
摘要基于智能体技术，提出了芯片制造生产线动态调度新方法，实现了投料调度、工件调度与设备维护调度的集成。 |
